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Listed one day ago
  • Global High-Tech Leader in a Fast-Growing Industry
  • Global High-Tech Leader in a Fast-Growing Industry
process engineer、manufacturing engineer: PROCESS: die bond, wire bond, burn in/test, Alignment
process engineer、manufacturing engineer: PROCESS: die bond, wire bond, burn in/test, Alignment
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering
classification: Engineering(Engineering)
1d ago
1d ago
Listed four days ago
  • Supportive, Collaborative Culture
  • Growth Without Burnout
  • Meaningful Work with Real Impact
  • Supportive, Collaborative Culture
  • Growth Without Burnout
  • Meaningful Work with Real Impact
process development (epoxy/solder), die/wire bonding, precision alignment, NPI, yield & reliability improvement
process development (epoxy/solder), die/wire bonding, precision alignment, NPI, yield & reliability improvement
subClassification: Process EngineeringProcess Engineering
classification: Engineering(Engineering)
4d ago
4d ago
Listed two days ago
  • 2 Month Fixed Bonus and quarterly Bonus 4 Times/Year
  • Working days: Monday to Friday (5 days per week)
  • Transportation allowance: THB 30 per day
  • 2 Month Fixed Bonus and quarterly Bonus 4 Times/Year
  • Working days: Monday to Friday (5 days per week)
  • Transportation allowance: THB 30 per day
Coordinate cross-department, ensure quality per APQP, improve yield, manage processes, audits, and resolve quality issues.
Coordinate cross-department, ensure quality per APQP, improve yield, manage processes, audits, and resolve quality issues.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering
classification: Engineering(Engineering)
2d ago
2d ago
Listed ten days ago
  • Grow through technical challenges, learning, and leadership opportunities
  • Grow through technical challenges, learning, and leadership opportunities
Process engineering leader driving manufacturing excellence through process optimization, quality improvement, problem-solving, and team development.
Process engineering leader driving manufacturing excellence through process optimization, quality improvement, problem-solving, and team development.
subClassification: Process EngineeringProcess Engineering
classification: Engineering(Engineering)
10d ago
10d ago
Listed twenty one days ago
  • Process Engineer
  • Wire bond
  • Die Attach
  • Process Engineer
  • Wire bond
  • Die Attach
Responsible for all process engineering, engineering problems solving and productivity promotion.
Responsible for all process engineering, engineering problems solving and productivity promotion.
subClassification: Mechanical EngineeringMechanical Engineering
classification: Engineering(Engineering)
21d ago
21d ago
Listed eighteen days ago
  • 2 Month Fixed Bonus and quarterly Bonus 4 Times/Year
  • Work at Bangna Location (BTS Bearing)
  • Good command of spoken and written English (Require TOEIC)
  • 2 Month Fixed Bonus and quarterly Bonus 4 Times/Year
  • Work at Bangna Location (BTS Bearing)
  • Good command of spoken and written English (Require TOEIC)
Responsible for in‑process quality assurance, excursion control, and defect prevention within semiconductor backend operations.
Responsible for in‑process quality assurance, excursion control, and defect prevention within semiconductor backend operations.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering
classification: Engineering(Engineering)
18d ago
18d ago
Listed two days ago
  • Attractive salary package
  • Attractive salary package
Performs aircraft structural repair and fabrication per approved technical data.Supports composite bonding and curing to ensure quality and compliance
Performs aircraft structural repair and fabrication per approved technical data.Supports composite bonding and curing to ensure quality and compliance
subClassification: TechniciansTechnicians
classification: Trades & Services(Trades & Services)
2d ago
2d ago
Listed eighteen days ago
  • Own end-to-end wafer singulation & wafer processing. high-value wafers
  • Lead DOE, yield & vendor qual
  • Drive roadmap & die sale growth
  • Own end-to-end wafer singulation & wafer processing. high-value wafers
  • Lead DOE, yield & vendor qual
  • Drive roadmap & die sale growth
1) Wafer Processing & Die Sale Team Leader: Lead wafer processing & die sale programs 2) Wafer Singulation Process Engineer: for Silicon Photonics
1) Wafer Processing & Die Sale Team Leader: Lead wafer processing & die sale programs 2) Wafer Singulation Process Engineer: for Silicon Photonics
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering
classification: Engineering(Engineering)
18d ago
18d ago
Listed four days ago
Good communication in English.
Good communication in English.
subClassification: TelecommunicationsTelecommunications
classification: Information & Communication Technology(Information & Communication Technology)
4d ago
4d ago
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