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Listed ten days ago

Process Engineer - Wire Bond / Die Bond

at Lumentum International (Thailand) Co., Ltd.

This is a Full time job

Pathum Thani
  • Grow through technical challenges, learning, and leadership opportunities
  • Grow through technical challenges, learning, and leadership opportunities
Process engineering leader driving manufacturing excellence through process optimization, quality improvement, problem-solving, and team development.
Process engineering leader driving manufacturing excellence through process optimization, quality improvement, problem-solving, and team development.
subClassification: Process EngineeringProcess Engineering
classification: Engineering(Engineering)
10d ago
10d ago
Listed one day ago

Process Engineer（Die Bond/Wire Bond）

at TFC TECHNOLOGY (THAILAND) CO., LTD.

This is a Full time job

Chon Buri
  • Global High-Tech Leader in a Fast-Growing Industry
  • Global High-Tech Leader in a Fast-Growing Industry
process engineer、manufacturing engineer: PROCESS: die bond, wire bond, burn in/test, Alignment
process engineer、manufacturing engineer: PROCESS: die bond, wire bond, burn in/test, Alignment
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering
classification: Engineering(Engineering)
1d ago
1d ago
Listed twenty one days ago

Process Engineer Wire bond/Die Attach (Chonburi)

at Fabrinet Co., Ltd.

This is a Full time job

Chon Buri
  • Process Engineer
  • Wire bond
  • Die Attach
  • Process Engineer
  • Wire bond
  • Die Attach
Responsible for all process engineering, engineering problems solving and productivity promotion.
Responsible for all process engineering, engineering problems solving and productivity promotion.
subClassification: Mechanical EngineeringMechanical Engineering
classification: Engineering(Engineering)
21d ago
21d ago
Listed two days ago

Process Engineer - Die Attach, Mold, Wirebond, Singulation (Wellgrow Industrial)

at UTAC Thai Limited

This is a Full time job

Chachoengsao
  • 2 Month Fixed Bonus and quarterly Bonus 4 Times/Year
  • Working days: Monday to Friday (5 days per week)
  • Transportation allowance: THB 30 per day
  • 2 Month Fixed Bonus and quarterly Bonus 4 Times/Year
  • Working days: Monday to Friday (5 days per week)
  • Transportation allowance: THB 30 per day
Mold, Wire bond, OR Singulation - Process Engineer
Mold, Wire bond, OR Singulation - Process Engineer
subClassification: Process EngineeringProcess Engineering
classification: Engineering(Engineering)
2d ago
2d ago
Listed two days ago

Process Engineer - Wire bond,Mold,Cu clip,AOI,SMT,Die attach (near BTS Bearing)

at UTAC Thai Limited

This is a Full time job

Bang Na, Bangkok
  • 2 Month Fixed Bonus and quarterly Bonus 4 Times/Year
  • Working days: Monday to Friday (5 days per week)
  • Transportation allowance: THB 30 per day
  • 2 Month Fixed Bonus and quarterly Bonus 4 Times/Year
  • Working days: Monday to Friday (5 days per week)
  • Transportation allowance: THB 30 per day
Coordinate cross-department, ensure quality per APQP, improve yield, manage processes, audits, and resolve quality issues.
Coordinate cross-department, ensure quality per APQP, improve yield, manage processes, audits, and resolve quality issues.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering
classification: Engineering(Engineering)
2d ago
2d ago
Listed eighteen days ago

Wafer Process Engineering (Manager/ Sr. Manager Level) - 2 Positions

at Stars Microelectronics (Thailand) Public Company Limited

This is a Full time job

Ayutthaya
  • Own end-to-end wafer singulation & wafer processing. high-value wafers
  • Lead DOE, yield & vendor qual
  • Drive roadmap & die sale growth
  • Own end-to-end wafer singulation & wafer processing. high-value wafers
  • Lead DOE, yield & vendor qual
  • Drive roadmap & die sale growth
1) Wafer Processing & Die Sale Team Leader: Lead wafer processing & die sale programs 2) Wafer Singulation Process Engineer: for Silicon Photonics
1) Wafer Processing & Die Sale Team Leader: Lead wafer processing & die sale programs 2) Wafer Singulation Process Engineer: for Silicon Photonics
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering
classification: Engineering(Engineering)
18d ago
18d ago
Listed twenty one days ago

W/B, DA & Mold Process Engineer and/or Sr. Process Engineer in FOL & EOL

at Hana Semiconductor (Ayutthaya) Co., Ltd.

This is a Full time job

Phra Nakhon Si Ayutthaya, Ayutthaya
Have technical knowledge of mold process, wire bond, die bond install machine, improve process, engineer tools & electronic environment manufacturing.
Have technical knowledge of mold process, wire bond, die bond install machine, improve process, engineer tools & electronic environment manufacturing.
subClassification: Process EngineeringProcess Engineering
classification: Engineering(Engineering)
21d ago
21d ago
Listed eighteen days ago

Field Service Engineer (Based in Thailand)

at MB AUTOMATION (MALAYSIA) SDN. BHD.

This is a Full time job

Bangkok
  • Opportunity Travel to Oversea
  • Attractive Benefits & Claims
  • Exposure & Training Provided
  • Opportunity Travel to Oversea
  • Attractive Benefits & Claims
  • Exposure & Training Provided
Install, service, and maintain the equipment, training to customer and ensure customer satisfaction.
Install, service, and maintain the equipment, training to customer and ensure customer satisfaction.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering
classification: Engineering(Engineering)
18d ago
18d ago
Listed eighteen days ago

Manufacturing Quality Engineer – Wire bond/ Die attached (Near BTS Bearing)

at UTAC Thai Limited

This is a Full time job

Bang Na, Bangkok
  • 2 Month Fixed Bonus and quarterly Bonus 4 Times/Year
  • Work at Bangna Location (BTS Bearing)
  • Good command of spoken and written English (Require TOEIC)
  • 2 Month Fixed Bonus and quarterly Bonus 4 Times/Year
  • Work at Bangna Location (BTS Bearing)
  • Good command of spoken and written English (Require TOEIC)
Responsible for in‑process quality assurance, excursion control, and defect prevention within semiconductor backend operations.
Responsible for in‑process quality assurance, excursion control, and defect prevention within semiconductor backend operations.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering
classification: Engineering(Engineering)
18d ago
18d ago
Listed one day ago

Senior Process Engineer (Die Bond / Wire Bond)

at Benchmark Electronics (Thailand) Public Company Limited
Be an early applicant

This is a Full time job

Phra Nakhon Si Ayutthaya, Ayutthaya
Lead micro‑electronics production for new products, including Die Bond, Wire Bond, and mechanical assembly. Develop and customer technical support.
Lead micro‑electronics production for new products, including Die Bond, Wire Bond, and mechanical assembly. Develop and customer technical support.
subClassification: Mechanical EngineeringMechanical Engineering
classification: Engineering(Engineering)
1d ago
1d ago
Listed twenty two days ago

ช่างแม่พิมพ์ Die Stamping

at บริษัท โพลีวิชั่น พรีซิชั่น โมลด์ (ประเทศไทย) จำกัด

This is a Full time job

Mueang Chonburi, Chon Buri
มีประสบการณ์หรือมีความสามารถในการซ่อมแม่พิมพ์โลหะ 2 ปีขึ้นไป สามารถทำโอทีได้
มีประสบการณ์หรือมีความสามารถในการซ่อมแม่พิมพ์โลหะ 2 ปีขึ้นไป สามารถทำโอทีได้
subClassification: MaintenanceMaintenance
classification: Engineering(Engineering)
22d ago
22d ago
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