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Listed twenty five days ago
  • Process Engineer
  • Wire bond
  • Die Attach
Responsible for all process engineering, engineering problems solving and productivity promotion.
subClassification: Mechanical EngineeringMechanical Engineering classification: Engineering(Engineering)
25d agoExpiring
Listed nine days ago
  • 2 Month Fixed Bonus and quarterly Bonus 4 Times/Year
  • Working days: Monday to Friday (5 days per week)
  • Transportation allowance: THB 30 per day
Coordinate cross-department, ensure quality per APQP, improve yield, manage processes, audits, and resolve quality issues.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
9d ago
Listed thirteen minutes ago
  • *Manage engineer team, coordinate, test operation improve yield, quality issues.
* Manage new product development ( Flip-chip technology and/or power packaging/or SMT ) and integrate process improvement.
subClassification: ManagementManagement classification: Engineering(Engineering)
13m ago
Listed nine days ago
  • 2 Month Fixed Bonus and quarterly Bonus 4 Times/Year
  • Working days: Monday to Friday (5 days per week)
  • Transportation allowance: THB 30 per day
NPI & Qualification lot management and execution at Mold process and Laser Mark.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
9d ago
Listed twenty days ago
  • 3-10 Years Exp in Electronics Manufacturer / 5 Days Working / Fast-paced Working
  • Incentive Allowance / Medical Allowance / Provident Fund / Fix Bonus
  • American Culture / Good Command in English / Location: Bang Pa-in
Lead micro‑electronics production for new products, including Die Bond, Wire Bond, and mechanical assembly. Develop and customer technical support.
subClassification: Mechanical EngineeringMechanical Engineering classification: Engineering(Engineering)
20d ago
Listed twenty days ago
  • New Graduated are welcome.
  • Experience in the Electronics industry
  • Experience in wire bond / die bond is a plus.
Key Responsibilities Provides process instruction for manufacturing. Handles process improvement for ultimate yield and quality, less scrap...
subClassification: Process EngineeringProcess Engineering classification: Engineering(Engineering)
20d ago
Listed two days ago
  • Working days: Monday to Friday, 8:00 AM - 5:00 PM
  • Work-life balance
  • Good benefits and welfare package
Responsibilities Support PCBA manufacturing process: Wave Soldering, Selective Wave Soldering, Conformal Coating, Ultrasonic Welding, Box...
subClassification: Process EngineeringProcess Engineering classification: Engineering(Engineering)
2d ago
Listed two days ago
  • Bachelor's Degree in Engineering
  • Experience in Process Engineer (Front Ent) PCBA
  • Leader for new customer / NPI
Manufacturing Engineer (NPI Project) Major Role & Responsibility; Technical Team Leader for new customer and/or major NPI. Technical...
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
2d ago
Listed two days ago
  • 2 Month Fixed Bonus and quarterly Bonus 4 Times/Year
  • Working days: Monday to Friday (5 days per week)
  • Transportation allowance: THB 30 per day
Perform DOE/molding evaluation, process validation, troubleshooting, RCA/8D, 5-Why, SPC, tool collaboration, production release & customer audits.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
2d ago
Listed twenty two days ago
  • Working days: Monday to Friday, 8:00 AM - 5:00 PM
  • Work-life balance
  • Good benefits and welfare package
Responsibilities Support PCBA manufacturing process: Wave Soldering, Selective Wave Soldering, Conformal Coating, Ultrasonic Welding, Box...
subClassification: Process EngineeringProcess Engineering classification: Engineering(Engineering)
22d ago
Listed twenty seven days ago
Lead Power QFN, Cu-clip and thin-die assembly process development, qualification, ramp-up and yield improvement.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
27d agoExpiring
Listed twenty days ago
  • 2 Month Fixed Bonus and quaterly Bonus 4 Times/Year
  • Work at Bangna Location (BTS Bearing)
  • Require TOEIC score
Lead NPI and product integration for semiconductor IC packaging, driving customer projects, qualification, yield improvement, and production ramp-up.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering classification: Engineering(Engineering)
20d ago
Listed twenty one days ago
The MQ Engineer is responsible for driving quality excellence across incoming materials, in‑process activities, customer complaint handling, and...
subClassification: Mechanical EngineeringMechanical Engineering classification: Engineering(Engineering)
21d ago
Listed twenty days ago

Be an early applicant

This is a Full time job

Bangkok
฿50,000 – ฿75,000 per month
Architects 6–12 layer, RF, and high-speed PCB layouts for autonomous UAVs, managing direct fabrication and EMC compliance for volume production.
subClassification: Aerospace EngineeringAerospace Engineering classification: Engineering(Engineering)
20d ago
Listed eighteen days ago

This is a Full time job

We are seeking a professional and meticulous Optical Module Coupling Engineer to join our manufacturing technical team. The incumbent will be...
subClassification: Engineering - SoftwareEngineering - Software classification: Information & Communication Technology(Information & Communication Technology)
18d ago
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