Modify my search
Listed ten days ago
  • Grow through technical challenges, learning, and leadership opportunities
  • Grow through technical challenges, learning, and leadership opportunities
Process engineering leader driving manufacturing excellence through process optimization, quality improvement, problem-solving, and team development.
Process engineering leader driving manufacturing excellence through process optimization, quality improvement, problem-solving, and team development.
subClassification: Process EngineeringProcess Engineering
classification: Engineering(Engineering)
10d ago
10d ago
Listed two days ago
  • 2 Month Fixed Bonus and quarterly Bonus 4 Times/Year
  • Working days: Monday to Friday (5 days per week)
  • Transportation allowance: THB 30 per day
  • 2 Month Fixed Bonus and quarterly Bonus 4 Times/Year
  • Working days: Monday to Friday (5 days per week)
  • Transportation allowance: THB 30 per day
Coordinate cross-department, ensure quality per APQP, improve yield, manage processes, audits, and resolve quality issues.
Coordinate cross-department, ensure quality per APQP, improve yield, manage processes, audits, and resolve quality issues.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering
classification: Engineering(Engineering)
2d ago
2d ago
Listed two days ago
  • Global High-Tech Leader in a Fast-Growing Industry
  • Global High-Tech Leader in a Fast-Growing Industry
process engineer、manufacturing engineer: PROCESS: die bond, wire bond, burn in/test, Alignment
process engineer、manufacturing engineer: PROCESS: die bond, wire bond, burn in/test, Alignment
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering
classification: Engineering(Engineering)
2d ago
2d ago
Listed two days ago
  • 2 Month Fixed Bonus and quarterly Bonus 4 Times/Year
  • Working days: Monday to Friday (5 days per week)
  • Transportation allowance: THB 30 per day
  • 2 Month Fixed Bonus and quarterly Bonus 4 Times/Year
  • Working days: Monday to Friday (5 days per week)
  • Transportation allowance: THB 30 per day
NPI & Qualification lot management and execution at Mold process and Laser Mark.
NPI & Qualification lot management and execution at Mold process and Laser Mark.
subClassification: Mechanical EngineeringMechanical Engineering
classification: Engineering(Engineering)
2d ago
2d ago
Listed twenty two days ago
  • Process Engineer
  • Wire bond
  • Die Attach
  • Process Engineer
  • Wire bond
  • Die Attach
Responsible for all process engineering, engineering problems solving and productivity promotion.
Responsible for all process engineering, engineering problems solving and productivity promotion.
subClassification: Mechanical EngineeringMechanical Engineering
classification: Engineering(Engineering)
22d ago
22d ago
Listed two days ago
  • 2 Month Fixed Bonus and quarterly Bonus 4 Times/Year
  • Working days: Monday to Friday (5 days per week)
  • Transportation allowance: THB 30 per day
  • 2 Month Fixed Bonus and quarterly Bonus 4 Times/Year
  • Working days: Monday to Friday (5 days per week)
  • Transportation allowance: THB 30 per day
Mold, Wire bond, OR Singulation - Process Engineer
Mold, Wire bond, OR Singulation - Process Engineer
subClassification: Process EngineeringProcess Engineering
classification: Engineering(Engineering)
2d ago
2d ago
Listed four days ago
  • Supportive, Collaborative Culture
  • Growth Without Burnout
  • Meaningful Work with Real Impact
  • Supportive, Collaborative Culture
  • Growth Without Burnout
  • Meaningful Work with Real Impact
process development (epoxy/solder), die/wire bonding, precision alignment, NPI, yield & reliability improvement
process development (epoxy/solder), die/wire bonding, precision alignment, NPI, yield & reliability improvement
subClassification: Process EngineeringProcess Engineering
classification: Engineering(Engineering)
4d ago
4d ago
Listed eight days ago
  • 2 Month Fixed Bonus and STI bonus
  • Working days: Monday to Friday (5 days per week)
  • Transportation allowance
  • 2 Month Fixed Bonus and STI bonus
  • Working days: Monday to Friday (5 days per week)
  • Transportation allowance
Lead semiconductor projects (OSAT). Manage end-to-end assembly, packaging & testing. Coordinate cross-functional teams to drive smooth product launch.
Lead semiconductor projects (OSAT). Manage end-to-end assembly, packaging & testing. Coordinate cross-functional teams to drive smooth product launch.
subClassification: Project ManagementProject Management
classification: Engineering(Engineering)
8d ago
8d ago
Listed twenty two days ago
Have technical knowledge of mold process, wire bond, die bond install machine, improve process, engineer tools & electronic environment manufacturing.
Have technical knowledge of mold process, wire bond, die bond install machine, improve process, engineer tools & electronic environment manufacturing.
subClassification: Process EngineeringProcess Engineering
classification: Engineering(Engineering)
22d ago
22d ago
Listed eighteen days ago
  • 2 Month Fixed Bonus and quarterly Bonus 4 Times/Year
  • Work at Bangna Location (BTS Bearing)
  • Good command of spoken and written English (Require TOEIC)
  • 2 Month Fixed Bonus and quarterly Bonus 4 Times/Year
  • Work at Bangna Location (BTS Bearing)
  • Good command of spoken and written English (Require TOEIC)
Responsible for in‑process quality assurance, excursion control, and defect prevention within semiconductor backend operations.
Responsible for in‑process quality assurance, excursion control, and defect prevention within semiconductor backend operations.
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering
classification: Engineering(Engineering)
18d ago
18d ago
Listed nineteen days ago
  • Own end-to-end wafer singulation & wafer processing. high-value wafers
  • Lead DOE, yield & vendor qual
  • Drive roadmap & die sale growth
  • Own end-to-end wafer singulation & wafer processing. high-value wafers
  • Lead DOE, yield & vendor qual
  • Drive roadmap & die sale growth
1) Wafer Processing & Die Sale Team Leader: Lead wafer processing & die sale programs 2) Wafer Singulation Process Engineer: for Silicon Photonics
1) Wafer Processing & Die Sale Team Leader: Lead wafer processing & die sale programs 2) Wafer Singulation Process Engineer: for Silicon Photonics
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering
classification: Engineering(Engineering)
19d ago
19d ago
Listed two days ago
Lead micro‑electronics production for new products, including Die Bond, Wire Bond, and mechanical assembly. Develop and customer technical support.
Lead micro‑electronics production for new products, including Die Bond, Wire Bond, and mechanical assembly. Develop and customer technical support.
subClassification: Mechanical EngineeringMechanical Engineering
classification: Engineering(Engineering)
2d ago
2d ago
Modify my search
How relevant are your results?

Receive new jobs for this search by email

Return to search results
Modify my search

Select a job

Display details here