Listed twelve days ago
This is a Full time job
subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineeringclassification: Engineering(Engineering)
- Min. 3 years of die bonding, flip chip attach, glob top, underfill, & die attach
- Hands-on experience in machine set-up and operation for die bonders
- Knowledge of Auto CAD (2D, 3D) or Solid Work
12d ago